- -20%

Foam polished pad with medium cutting power with technology CCS
Privacy Policy
Payments and Shipping
Complaints and Returns
CCS™ Technology
Conventional foam pads absorb polishing compound too quickly, reducing both the efficiency of polishing and the pad’s performance, as much of the compound is trapped beneath the working surface of the pad. CCS™ technology addresses this common issue by using strategically designed partially closed-cell foam patterns. Now available in our Standard Duty Orbital (SDO) pads, it provides the same consistent performance as the SDO pads, with the added benefit of CCS technology.
Benefits:
Low Absorption Rate: CCS pockets gradually release the compound as needed by the operator.
Prevents Pad Skipping: CCS pockets reduce surface tension, allowing the operator to move the pad smoothly across the working surface.
Tapered Edge: Prevents the pad from rolling and ensures excellent pad rotation, making it ideal for curved and contoured surfaces. This allows for precise polishing in hard-to-reach areas.