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Foam Polishing Pad with High Cutting Power and CCS Technology
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Conventional foam pads absorb polish too quickly, reducing polishing efficiency as most of the product gets trapped beneath the pad's surface. CCS™ technology addresses this common issue by incorporating strategic patterns of partially closed foam cells. Now available in our Standard Duty Orbital (SDO) pads, this provides the operator with the same consistent performance as SDO pads, along with the added benefits of CCS technology.
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