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Foam Polishing Pad with CCS Technology
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Foam Polishing Pad with CCS Technology
Conventional foam pads absorb polish too quickly, reducing the efficiency of polishing and the pad itself, as most of the polish is trapped beneath the working surface of the pad. CCS™ Technology addresses this common issue with strategically designed partially closed-cell foam patterns. Now available in our Standard Duty Orbital (SDO) pads, this technology provides the same consistent performance as SDO pads with the added benefit of CCS technology.
Benefits: